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        3D納米形貌測量儀
        3D納米形貌測量儀

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        heliInspectTM H4 - 3D Measurement Head

        Equipped with the high-speed 3D imager heliSenseTM S3, this brand new measurement module combines sub-micrometer surface metrology with large field of views. The H4 operates as a non-contact white light interferometer on almost any surface, including glass and metal.

        The H4 is engineered for in-line applications requiring high throughput and robustness. Customized modules are available for equipment manufacturers.

        As all Heliotis products, the module is manufactured in Switzerland for long lasting reliability.

        The instrument utilizes Heliotis’ proven parallel Optical Coherence Tomography principle and offers unmatched scan rates. Fast acquisition rates and a special design of the interferometer render vibration isolation obsolete.

        The new 3D vision module can be mounted on most motorized positioning systems. Pre-qualified stages are also available from Heliotis and partners. Choices include

        • resolution 1um (standard), 100 nm (optional)

        • travel range from 40 mm to 1 m

        • software interfaces: C++, LabViewTM, Python

        If desired, our engineering team will design and deliver a turn-key system that matches your application.

        Specifications

        Measurement Module

        3D sensor

        proprietary smart pixel sensor heliSenseTMS3 with in-pixel signal processing of up to 1 million 2D-slices per second

        2D modelive-view for navigation on sample (optional)
        light source

        standard: high power LED (red)

        option: Superluminescent Light Emitting Diode

        center= 840 nm, Δλ = 40 nm, Poptical = 8 mW)

        field of view

        11.28 x 11.6 mm (standard configuration),

        numerical aperture0.1 (standard configuration)
        working distance16 mm (standard configuration)
        vertical resolution200 nm, 20 nm (optional)
        vertical scan speedup to 50 mm per second
        lateral resolution

        40 μm

        reflectivity of sample< 0.1 % to 100 %

        Scan Module

        Z-axis

        80 mm vertical scan range

        100 nm resolution

        up to 100 mm per second

        Software

        HeliCommander

        configuration and control of the system

        navigation via 2D live view

        graphical representation of 3D topography and profiles

        data processing and analysis

        data management and storage

        automation of measurement tasks (recipes)

        Application Programming

        Interface

        C++, Python and LabView 2012, macros (ImageJ)

        (scanner control, 3D-camera configuration and readout, data processing algorithms

        Applications

        Providing fast and robust 3D-metrological data, Heliotis' unique technology is capable of bringing innovations to many different fields - limited only by your imagination.

        To explore what our technology can do for you, please send us a short description of your measurement task. We will gladly perform test measurements of your samples free of charge.

        Electronics, Technical Surfaces

        CSPs and micro-BGAs continue to increase the packaging density of PCBs, but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration, monitor process statistics for SPC and increase First Pass Yield.

        Likewise, the requirement on technical surfaces typically increases with miniaturization as surfaces roughness become more significant and tolerances smaller. True 3D-inspection yields unambiguous quality data and can provide feedback to the manufacturing process.

        Micro-mechanics, Micro-optics

        Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range, conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified.

        The M3 helps the developer to quickly gain an in-depth understanding of the true 3D shapes produced by a set of process parameters. The M3 takes 3D profiles of almost any material (reflective and diffusive). For inspection no preparation of the devices is necessary.

        Life Science

        The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light.

        In contrast to scanning electron microscopes, the samples do not need to be coated or evacuated. Thus, the M3 allows for rapid characterization of biological samples and even delivers quantitative 3D data.

        Forensics & Security Solutions

        Fnology is used for comparing cartridge cases from crime scenes, demonstrating superior performance over legacy 2D systems. Furthermore, the detailed 3D-metrology is instrumental in detecting counterfeits and forgery.

        There are numerous possibilities for innovative security products based on micro 3D-features. The M3 is the perfect tool for creating it.

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