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        3D形貌測量儀

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        heliProfilerTM M3 / M3-XL - Efficient 3D Measurements

        Progress in science and technology is often triggered by advanced measurement techniques. While there is always the possibility of guessing it right, detailed observation and in-depth analysis are indispensable for systematic and productive work. The new M3 Optical Profiler from Heliotis brings superior 3D-metrology to the professional in engineering and science. It has been designed for the most demanding applications in micromechanics, electronics, life sciences and forensics.

        Heliotis’ proprietary smart-pixel CMOS-sensor and its “parallel Optical Coherence Tomography” give the M3 an edge in terms of measurement speed and precision on almost any surfaces. The instrument has been engineered for productivity and reliability. It is manufactured in Switzerland for long lasting reliability.

        Specifications for M3-XL Optical Profiler

        Measuring module

        3D-Sensor

        Proprietary smart pixel sensor heliSenseTM S3with in-pixel signal processing of up to 1 million 2D-slices per second

        2D-CameraLive-view supports navigation on sample
        Light sourceStandard: Superluminescent Light Emitting Diode

        center= 800 nm, Δλ = 40 nm, Poptical = 8 mW)

        Field of View0.6 x 0.6 mm (standard configuration)
        NA0.4 (standard configuration)
        Working distance2.8 mm (standard configuration)
        Vertical resolution1 μm (standard configuration, 20 nm optional)
        Lateral resolution

        2 μm (standard configuration)

        Scan modules

        Z-axis

        20 mm vertical scan range

        100 nm resolution

        Up to 50 mm per second

        XY-table

        300 x 400 mm positioning range

        1 μm resolution (100 nm optional)

        Up to 100 mm per second

        Software

        Graphical User Interface

        Configuration and control of the system

        Navigation via 2D-live-view

        Graphical representation of 3D-topography and profiles

        Data processing and analysis

        Data management and storage

        Automation of measurement tasks (recipes)

        Application Programming

        Interface

        C++, Python and LabView 8.x

        (scanner control, 3D-camera configuration and readout, 2D-camera configuration and readout, data processing algorithms

        Applications

        Providing fast and robust 3D-metrological data, Heliotis' unique technology is capable of bringing innovations to many different fields - limited only by your imagination.

        To explore what our technology can do for you, please send us a short description of your measurement task. We will gladly perform test measurements of your samples free of charge.

        Electronics, Technical Surfaces

        CSPs and micro-BGAs continue to increase the packaging density of PCBs, but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration, monitor process statistics for SPC and increase First Pass Yield.

        Likewise, the requirement on technical surfaces typically increases with miniaturization as surfaces roughness become more significant and tolerances smaller. True 3D-inspection yields unambiguous quality data and can provide feedback to the manufacturing process.

        Micro-mechanics, Micro-optics

        Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range, conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified.

        The M3 helps the developer to quickly gain an in-depth understanding of the true 3D shapes produced by a set of process parameters. The M3 takes 3D profiles of almost any material (reflective and diffusive). For inspection no preparation of the devices is necessary.

        Life Science

        The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light.

        In contrast to scanning electron microscopes, the samples do not need to be coated or evacuated. Thus, the M3 allows for rapid characterization of biological samples and even delivers quantitative 3D data.

        Forensics & Security Solutions

        Fnology is used for comparing cartridge cases from crime scenes, demonstrating superior performance over legacy 2D systems. Furthermore, the detailed 3D-metrology is instrumental in detecting counterfeits and forgery.

        There are numerous possibilities for innovative security products based on micro 3D-features. The M3 is the perfect tool for creating it.

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