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美國OAI晶元綁定機(jī)晶圓接合器 AML

晶片接合在MST，MEMS和微工程領(lǐng)域中已經(jīng)發(fā)現(xiàn)了許多應(yīng)用。 這些包括壓力傳感器，加速度計(jì)，微型泵和其他流體處理裝置的制造。 該工藝還用于硅微結(jié)構(gòu)的一級(jí)封裝以隔離封裝引起的應(yīng)力。

OAI AML晶片接合器促進(jìn)在高真空室中原位進(jìn)行對(duì)準(zhǔn)和接合。 對(duì)于陽極接合，將晶片冷加載并在處理室中加熱。 對(duì)于高精度對(duì)準(zhǔn)，晶片被對(duì)準(zhǔn)并且僅在達(dá)到工藝溫度之后才接觸，因此避免了可能損害對(duì)準(zhǔn)的不同的熱膨脹效應(yīng)。 AML晶片接合器非常適合陽極接合，硅直接和熱壓接合應(yīng)用。 這些特性使焊接機(jī)能夠與幾乎任何加工工具一起使用。

AML Wafer Bonder

Wafer bonding has found many applications in the field of MST， MEMS and micro engineering. These include the fabrication of pressure sensors， accelerometers， micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses.

The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ， in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached， thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding， silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.