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RKD公司的Elite Etch是一個(gè)自動(dòng)混酸解封裝置，通過各種先進(jìn)功能的整合來提高生產(chǎn)力，使用現(xiàn)代化材料和**工業(yè)設(shè)計(jì)。通過提供精確、微等分硝酸、硫酸或混合酸，RKD公司的Elite Etch蝕解封裝設(shè)備能夠迅速和便捷地打開*精致的封裝并保證不會(huì)損壞樣品。
RKD Elite Etch蝕刻酸解封裝置集成了許多的工程創(chuàng)新。采用優(yōu)質(zhì)級(jí)碳化硅加工的整體式蝕刻頭組件具有優(yōu)異的耐酸性，再加上活性氮?dú)怏w監(jiān)測(cè)和凈化系統(tǒng)這一整體的設(shè)計(jì)，降低了開封完成后殘留在蝕刻頭上酸的冒煙情況。選擇單片碳化硅也可以縮短升溫時(shí)間。
蝕刻頭使用低熱質(zhì)量的設(shè)計(jì)。其他制造商使用高熱質(zhì)量設(shè)計(jì)和復(fù)雜可互換的組件如可移動(dòng)的蝕刻頭插入，具有不可靠的性能特點(diǎn)。我們簡單但有效的設(shè)計(jì)大大減少了蝕刻頭的清洗和周圍堵塞的情況。
設(shè)備限制鼻壓頭是手動(dòng)下壓，是專為大量的使用所設(shè)計(jì)。鼻壓頭通?？s回，只在安全蓋完全關(guān)閉后延伸。RAM的鼻子垂直運(yùn)動(dòng)的固定裝置的蝕刻頭從而消除或包或夾具的運(yùn)動(dòng)。
RKD Engineering’s Elite Etch incorporates the latest innovations. The etch head is machined from premium grade silicon carbide for its extreme acid and temperature resistance. Coupled with an active nitrogen gas monitoring and purge system， this monolithic design to reduces the fuming of residual acids left on the etch head after each decapsulation process. The silicon carbide etch head enables short heat-up times with high thermal conductivity.
The device hold-down assembly (ram nose) is a pneumatically activated and is designed for a large amount of travel. The ram nose only extends when the safety cover is fully closed to ensure absolute vertical movement. The ram nose secures the sample to the etch head， thus eliminating movement of either the package or its fixturing.
The safety cover is operated manually for safe control of the operation. This guarantees to the operator that the cover has sealed correctly. Acid flow lines and system assemblies are radially symmetrical compression joints which are engineered to eliminate high pressure seal failures.
The Elite Etch is designed to fit comfortably inside of a fume hood while maintaining all necessary safety features. By using a heat exchange system， waste acid is cooled below 90 C to allow the use of a single waste bottle. The Elite Etch uses 3 standard 500 ml bottles which are supplied with the system.
RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchanges.
| Etcher Unit | Height: 300 mm (13 in) |
|---|---|
| Width: 190 mm (7.5 in) | |
| Depth: 305 mm (12 in) | |
| Bottle Assembly | Height: 254 mm (10 in) |
| Width: 280 mm (11 in) | |
| Depth: 127 mm (5 in) | |
| Weight | Approx. 16 kg (35 lb) |
| Power Source | 90 to 250 VAC， 50 to 60 Hz (4 amp) |
| Acid temp. range | 20° to 250° C |
| Acid temp. set point | 1° C ± 1% of setting |
| Etch cavity (up to) | 22 mm x 22 mm (30 mm diagonal) |
| Choice of Acids | fuming nitric acids， mixed fuming nitric and sulfuric acids， or fuming/concentrated sulfuric acid |
| Acid Mix Ratios | (nitric to sulfuric ratios) 9:1， 5:1， 4:1， 3:1， 2:1， 1:1 |
| Post Etch Rinse Options | sulfuric acids， fuming nitric acids， mixed acids， or no rinse |
| Etch Times | 1 to 1，800 seconds in 1 second increments (1 seconds to 30 minutes) dynamic (real time) adjustments of etch time |
| Etch Temperature Ranges | 20° to 90° C (nitric acid)， 20° to 250° C (sulfuric acid)， 20° to 100° C (mixed acids) |
| Etchant Volume Selection | 1 to 6 ml per minute - for all acids & acid mixes |
| Operator Program Storage | 100 programs stored to nonvolatile memory |
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