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面議型號(hào)
手動(dòng)SPM清洗機(jī)品牌
江蘇聲達(dá)產(chǎn)地
江蘇樣本
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適用工件: (Applicable parts) | 4”*2 pcs,6”*2 pcs,8"*1 pc晶圓片 4”*2 pcs,6”*2 pcs,8”*1pc Wafer |
批量產(chǎn)能: (Capacity) | 1 batch/30min |
工藝流程: (Procedure flow) | LOAD(手動(dòng))→SPM槽→HQRD槽→HOF槽→UNLOAD(手動(dòng)) |
主要材料: (Major material) | 金屬骨架SUS304+PP瓷白板,槽體采用PPN/石英 (Metal frame SUS 304,PP board,the tank uses PPN/silicon) |
運(yùn)送方式: (Transportation) | 手動(dòng)傳送 (Manual) |
節(jié)拍時(shí)間: (Step time) | 依工藝可調(diào) (Based on process,Adjustable) |
工藝效果: (Process effect) | 清除晶圓片表面的有機(jī)物 (Removal organics on the surface of wafer) |
其他說(shuō)明: (Others) | 設(shè)備可以根據(jù)客戶要求定制手動(dòng)/半自動(dòng) (Customized:Semiautomatic or manual) |
適用工件: (Applicable parts) | 4”*2 pcs,6”*2 pcs,8"*1 pc晶圓片 4”*2 pcs,6”*2 pcs,8”*1pc Wafer |
批量產(chǎn)能: (Capacity) | 1 batch/30min |
工藝流程: (Procedure flow) | LOAD(手動(dòng))→SPM槽→HQRD槽→HOF槽→UNLOAD(手動(dòng)) |
主要材料: (Major material) | 金屬骨架SUS304+PP瓷白板,槽體采用PPN/石英 (Metal frame SUS 304,PP board,the tank uses PPN/silicon) |
運(yùn)送方式: (Transportation) | 手動(dòng)傳送 (Manual) |
節(jié)拍時(shí)間: (Step time) | 依工藝可調(diào) (Based on process,Adjustable) |
工藝效果: (Process effect) | 清除晶圓片表面的有機(jī)物 (Removal organics on the surface of wafer) |
其他說(shuō)明: (Others) | 設(shè)備可以根據(jù)客戶要求定制手動(dòng)/半自動(dòng) (Customized:Semiautomatic or manual) |
適用工件: (Applicable parts) | 4”*2 pcs,6”*2 pcs,8"*1 pc晶圓片 4”*2 pcs,6”*2 pcs,8”*1pc Wafer |
批量產(chǎn)能: (Capacity) | 1 batch/30min |
工藝流程: (Procedure flow) | LOAD(手動(dòng))→SPM槽→HQRD槽→HOF槽→UNLOAD(手動(dòng)) |
主要材料: (Major material) | 金屬骨架SUS304+PP瓷白板,槽體采用PPN/石英 (Metal frame SUS 304,PP board,the tank uses PPN/silicon) |
運(yùn)送方式: (Transportation) | 手動(dòng)傳送 (Manual) |
節(jié)拍時(shí)間: (Step time) | 依工藝可調(diào) (Based on process,Adjustable) |
工藝效果: (Process effect) | 清除晶圓片表面的有機(jī)物 (Removal organics on the surface of wafer) |
其他說(shuō)明: (Others) | 設(shè)備可以根據(jù)客戶要求定制手動(dòng)/半自動(dòng) (Customized:Semiautomatic or manual) |
適用工件: (Applicable parts) | 4”*2 pcs,6”*2 pcs,8"*1 pc晶圓片 4”*2 pcs,6”*2 pcs,8”*1pc Wafer |
批量產(chǎn)能: (Capacity) | 1 batch/30min |
工藝流程: (Procedure flow) | LOAD(手動(dòng))→SPM槽→HQRD槽→HOF槽→UNLOAD(手動(dòng)) |
主要材料: (Major material) | 金屬骨架SUS304+PP瓷白板,槽體采用PPN/石英 (Metal frame SUS 304,PP board,the tank uses PPN/silicon) |
運(yùn)送方式: (Transportation) | 手動(dòng)傳送 (Manual) |
節(jié)拍時(shí)間: (Step time) | 依工藝可調(diào) (Based on process,Adjustable) |
工藝效果: (Process effect) | 清除晶圓片表面的有機(jī)物 (Removal organics on the surface of wafer) |
其他說(shuō)明: (Others) | 設(shè)備可以根據(jù)客戶要求定制手動(dòng)/半自動(dòng) (Customized:Semiautomatic or manual) |
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